The emergence of advanced heat dissipation substrates originated from the increasing inadequacy of traditional printed circuit boards (PCBs) and thick-film alumina substrates in meeting demands for advanced heat dissipation capacity, circuit precision, current-carrying capability, and reliability.
As electronic components operate, the generated heat requires more efficient conduction pathways to address the issue of waste heat accumulation during electrical-to-optical conversion, which shortens service life. Concurrently, finer circuit patterning is essential to interconnect increasingly miniaturized, high-density chips.
Application Description
Advanced heat dissipation substrates emerged to address limitations of traditional PCBs and thick-film alumina substrates in high-power, high-density electronics. As devices miniaturized and performance increased – particularly in electro-optical applications like high-power LEDs and laser diodes – ineffective advanced heat dissipation caused temperature spikes, reducing component lifespan and compromising reliability.
Key Advantages of Advanced Heat Dissipation Substrates
1.Enhanced Thermal Management: High-thermal-conductivity materials rapidly transfer heat to heat sinks.
2.Fine-Pitch Circuitry: Advanced processes (thin-film/DPC) enable high-density chip interconnects.
3.High Current Tolerance: Robust metal layers support power-intensive operations.
4.Improved Reliability: Effective thermal control extends device lifetime.
Critical Applications
1.Industrial Lasers
- Application Examples: Cutting/welding systems
- Substrate Role: Prevents wavelength drift & failure in AlN-based substrates
2.Optical Communications
- Application Examples: 5G/data center transceivers
- Substrate Role: Maintains signal integrity in high-speed lasers
3.Sensors
- Application Examples: LiDAR/3D sensing
- Substrate Role: Ensures thermal stability for measurement accuracy
4.Medical
- Application Examples: Surgical/ophthalmic lasers
- Guarantees operational safety through consistent thermal management
Lincotec provides high-performance advanced heat dissipation substrates with custom manufacturing and co-development services tailored to industrial laser, optical communication, sensor, and medical applications.
