Application Fields PRODUCTS

Application Description

Non Plating Line (NPL) or thin copper plating technology offers a method where it's not necessary to place plating wires on the surface of a substrate. Instead, it allows for the selective plating of nickel-gold on the contact pads at the edges of the substrate. This technology primarily utilizes a conductive film as the path for electrical conduction to connect the various contact pads on the substrate, enabling the electroplating of nickel-gold.

The circuit configuration using the NPL process doesn't require additional plating wires on the substrate surface. This leads to a reduction in the substrate size and wire material. It not only facilitates circuit layout but also prevents noise caused by redundant plating wires during high-frequency usage, resulting in improved performance.

Referring to the descriptions in the relevant patents by Quanmao Electronics (merged into Unimicron in 2009), the NPL process is generally as follows:

In this regard, Lincotec possesses proprietary intellectual property and holds key process technologies, such as adhesion of coatings, coating uniformity, edge film thickness, coating resistance, control of substrate surface temperature, Cpk, UPH, target material utilization rate, selective etching, and etching uniformity, etc. Furthermore, the company can integrate both front-end and back-end processes to control process parameter characteristics and provide excellent processing performance and stable reproducibility. Lincotec has rich intellectual property in process validation and has qualified, highly precise laboratories for sample testing, enabling collaboration with customers in process development and experimental validation.

Lincotec Features

Specialized in Sputter and Etching technologies, mastering key capabilities for RDL (Redistribution Layer).

• Provides sputtering and etching process equipment and solutions.
• Offers outstanding thin film adhesion and uniformity with high reproducibility.
• Offers the most competitive cost of production (C.O.O) in the market, with a high cost-performance ratio (C/P).
• Modular sputtering chamber with expandability, allowing selective upgrades after equipment deployment.
• Provides product prototyping and professional technical consultation to expedite time-to-market.
• Holds several key process patents, effectively enhancing coating uniformity and production capacity.
• Exceptional temperature control capabilities to prevent damage.
• Utilizes AI-driven human-machine interface and big data analysis for stable process parameter control.
• High sputtering target utilization, with longer target replacement and maintenance cycles, reducing production costs. Offers the option of planar or rotary targets.
• Has the capability to integrate front and back-end processes (Plasma Etching / Taping/ Attach/ Detach/ Load/ Unload/ Carrier Reclamation), providing automation solutions.