[2024-05-24]
Advanced Packaging Redistribution Layer Process
"Know Good Die (KGD)" manufactured with advanced semiconductor process technology typically has higher circuit density. Fan-out is necessary to redistribute the I/O pads from the narrow area on the surface of the bare die for subsequent chip assembly.
The Redistribution Layer (RDL) utilizes wafer-level metal wiring technology to extend the circuit contact points from the chip to the outside. Simultaneously, it achieves a thinner packaging thickness and superior electrical performance.
The Redistribution Layer (RDL) utilizes wafer-level metal wiring technology to extend the circuit contact points from the chip to the outside. Simultaneously, it achieves a thinner packaging thickness and superior electrical performance.