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ABOUT
Company Introduction
Service Locations
Honors and Recognitions
Product Innovation Evolution
APPLICATION
Overview of Application fields
Advanced Semiconductor Packaging
EMI Shielding Sputtering
Fan-Out Packaging
Advanced Packaging Redistribution Layer Process
Advanced Substrate and High-End PCB Fine Line Process
Non-Plating Line (NPL) Plating Technology
Backside Metallization
Coreless Substrate Application
Next-Generation Displays
Mini LED&Micro LED
Transparent Conductive Oxide Coatings
Green Energy Technology Applications
Roll-to-Roll Thin Film Material Sputtering Solutions
PRODUCT
Overview of Product and Technologies
Plasma Etching Technology Capabilities and Products
Thin Film Sputtering Technology Capabilities and Products
OEM Services and Technical Capabilities
Sampling Services and Verification Capabilities
After-Sales Service
Intellectual Property Declaration
SUSTAINABLE
Message from the Management
Sustainable Governance
Sustainable Environment
Sustainable Innovation
Diverse and Inclusive Society
NEWS
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Elite Recruitment
Recruitment Process
Compensation and Benefits
Friendly Work Environment
CONTACT
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Event Announcements
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News Announcements
Event Announcements
Exciting Videos
Technology Highlights
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