Fan-Out Packaging

In the post-Moore's Law era, the research and equipment costs of front-end processes have significantly increased. Adopting advanced packaging to further enhance chip integration and reduce manufacturing costs is a transformative trend in the semiconductor industry. Fan-out packaging technologies, including FOWLP and FOPLP, share the ability to form more I/O pins in a fan-out fashion. This enables a single chip to integrate more functions, achieving advantages such as thinning and cost reduction. The main difference lies in the carrier used during production, allowing a balance between fine line size and packaging cost based on the chip applications.