每个电子组件或其系统在运作时都会生成一定程度的电磁干扰 (EMI)，这会对周边电器的性能生成不利影响。因此，电子组件或其系统的电磁干扰必须受到限制，同时，对环境中的干扰也必须具有足够的免疫力。
“抗电磁干扰屏蔽溅镀”即是以干式制程於电子组件的外表面以物理的方式附着上足够厚度的屏蔽层，借此达到电磁屏蔽的目的。
应用说明
“抗电磁干扰屏蔽溅镀”是於电子组件的外表面披复足够厚度之金属层，借此降低电子组件对外界生成电磁干扰，亦避免外界的电磁进入内部而影响电子组件的运作。大部分的国家对于电磁标准制定了明确的认证制度，且多是基于国际电工委员会（International Electrotechnical Commission；IEC）所订定的EMC（Electromagnetic Compatibility ；电磁兼容性）标准。
IEC官网对于EMC有以下的说明：
“Every electrical and electronic device produces a certain level of so-called electromagnetic interference (EMI) that can adversely affect the performance of similar equipment located nearby.
Electromagnetic compatibility (EMC) provides methods that help contain EMI so that electrical and electronic systems or components are able to work correctly even when they are close together. In essence, EMC is about protecting sensitive equipment such as radio receivers, domestic appliances or electronic circuits from electromagnetic interference, and containing the electromagnetic emissions for example from large scale batteries, power lines or electric motors so that they can't interfere with more sensitive devices.
Multiple sources of electromagnetic disturbances can have a cumulative effect on a device. For example, the emissions from several laptop computers combined with those from mobile phones could disrupt systems in an aircraft.
The electromagnetic disturbances from each item of equipment must be limited and, simultaneously, each item must have an adequate level of immunity to the disturbances in its environment.”
一般而言，用于军工或太空领域中的设备或电子系统有严格的可靠度要求，而即使是例如智能型手机、电视、有Wifi或蓝牙的数位相机等具通信功能的消费型电子产品，除了於其外壳进行抗电磁干扰屏蔽以符合前述的认证规范之外，为了降低不同芯片或电子组件之间因电磁干扰而生成的错误运作，还需进一步针对各芯片模块进行屏蔽。例如分别对WiFi模块、Bluetooth模块、RFFE（RF Front-end；射频前端）模块、PMIC（Power Management IC；电源管理芯片）模块等进行抗电磁干扰屏蔽。
而溅镀（Sputtering）制程设备属於物理气相沉积（Physical Vapor Deposition；PVD）的技术运用，能在真空环境及较低的温度下以物理方式制备出高熔点材料的均匀薄膜镀层。尤其当芯片日趋微小且各厂致力于缩小相邻电子组件之间的间距时，於SiP（System in Package；系统级芯片封装）制程阶段即导入抗电磁干扰屏蔽溅镀设备，并以干式的物理方式於电子组件的外表面附着上足够厚度的屏蔽层，将是最具有产能及环保效益的选择。
对此，抗电磁干扰屏蔽溅镀设备的制程验证至少包含：附着测试、膜厚均匀性量测、侧边膜厚量测、镀膜阻值量测、待镀物表面温度限制、Cpk、UPH、靶材利用率等。进一步还需整合前后段制程，以掌握待镀物的参数特性，并提供优异的加工表现及稳定的再现性。凌嘉科技对于前述制程验证有丰富的知识产权，并拥有合格且高精密度的实验室能进行样品的测试，协同客户进行制程开发及实验验证。
凌嘉特色
世界知名手机大厂（Tier 1）指定的EMI溅镀设备
实绩
